TIM (Thermal Interface Material) for Mobile AP Chipset

Ntrium's unique and innovative technology solves the issue of overheating in advanced single high performance packaging material such as Mobile AP, protecting it from damage and speed slowdown due to overheating. Ntrium's patented TIM technology achieves much higher thermal conductivity and heat dissipation performance than other existing silicone-based TIM.

Thermal Conductivity (TIM) : Above 100W/mkThermal Conductivity (Heat Sink) : Above 1,500W/mk

www.ntrium.com

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