Thermally Enhanced Underfill Filler
Fillers are most important single ingredient in Underfill of Flip Chip Package, especially for improving the thermal conductivity.
Thermal Conductivity (Filler Particle): Above 50W/mK (The existing Filler particle from another companies: Usually 1.4W/mK)
www.ntrium.com
skach@gobizkorea.com
+82-2-3667-5081
I had no idea that fillers were so important. My brother is trying to start a project like this, but I'm not sure if he is aware of how crucial fillers are. I'll have to call and let him know. Thanks for the information! http://www.alltemated.com/products/place_n_bond/
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