Silver Powder Alternative (Core-Shell) for Printed Electronics - Ntrium.com

Silver Powder Alternative (Core-Shell) for Printed Electronics

The field of Printed Electronics is clearly spreading from Touch Screen Panel, to Solar Cell Electrodes, RFID, FPCB and further applications. The persistently high price of silver, which retards the use of silver inks and pastes in cost-sensitive applications, calls the alternative cost efficient nano-particles.
With Ntrium's sophisticated coating technology, we're conducting research and development of Core-Shell type nano-particle which can substitute the silver powder. The low cost core materials with silver coated layer can reduce up to 50% price from the existing silver powder.

www.ntrium.com

skach@gobizkorea.com

+82-2-3667-5081

TIM (Thermal Interface Material) for Mobile AP Chipset

Ntrium's unique and innovative technology solves the issue of overheating in advanced single high performance packaging material such as Mobile AP, protecting it from damage and speed slowdown due to overheating. Ntrium's patented TIM technology achieves much higher thermal conductivity and heat dissipation performance than other existing silicone-based TIM.

Thermal Conductivity (TIM) : Above 100W/mkThermal Conductivity (Heat Sink) : Above 1,500W/mk

www.ntrium.com

skach@gobizkorea.com

+82-2-3667-5081

Thermally Enhanced Underfill Filler - Ntrium.com

Thermally Enhanced Underfill Filler

Fillers are most important single ingredient in Underfill of Flip Chip Package, especially for improving the thermal conductivity.
Thermal Conductivity (Filler Particle): Above 50W/mK (The existing Filler particle from another companies: Usually 1.4W/mK)

www.ntrium.com

skach@gobizkorea.com

+82-2-3667-5081

Conductive Beads for ACF (Anisotropic Conductive Film)

Conductive Beads for ACF (Anisotropic Conductive Film)

Conductive Bead is a core component of ACF (Anisotropic Conductive Film) which is used in the Displays (LCD/PDP) and Touch Screen Panels to make the electrical and the mechanical connections between Glass and Chip/FPCB.

Main Product : Polymer Cored Bead
Particle Shape : Spherical
Particle Size : Customizable (1~50um)

www.ntrium.com

skach@gobizkorea.com

+82-2-3667-5081

Nano Core Shell technology

Ntrium's Core Technologies

(1) Nano-Coating Technology of Fine Particles
- Control the thickness and the material property of the coating layers to meet customer satisfaction.
- Coating Thickness: 1 ~ 5,000nm / Coating Material: Au, Ag, Ni, Cu, Sn, Various Alloys and Oxides
(2) Particle Dispersion and Mixing Technology
- Optimized R&D infrastructure and production capabilities for the diverse dispersion solutions and technologies
- Ntrium can blend Nano/Micro-sized paricles homogeneously with Solvent or Resin
(3) Nano/Micro-Particle Synthesis Technology
- Particle Size: 10nm ~ 100um / Particle Shape: Spherical, Granule, Flake, Wire, etc.
- Particle Material: Metal, Oxide, Polymer, etc. / Particle Structure: Single or Composite Material, Coated Material, etc.

(4) Nano-Convergence Technology
- Convergence between Nano-material and the Microelectronics packaging technology of Display / Semiconductor / Mobile / IT products
- Nano-materials for Energy (Solar cell, Rechargeable battery), Biomedical, Cosmetics and Automobiles

Please contact us at www.ntrium.com
+82-2-3667-5081
skach@gobizkorea.com